While you’re preparing your submissions for the annual AIA Hong Kong Honors and Awards Program, it’s time for us to introduce our distinguished panel of jurors from Beijing, Singapore and Hong Kong.
Raymond Fung JP, FHKIA, Hon. AIA (HK)
Member of Development Committee | WKCD
Wenjing Huang AIA
Founding Partner | OPEN Architecture, Beijing
Erik Gerard L’Heureux AIA LEED AP BD+C
Vice Dean – Department of Architecture | National University of Singapore
Principal | Pencil Office, US
Colin Ward RIBA, ARB
Senior Partner – Architect | Foster + Partners
Don’t miss the opportunity to submit your work for this prestigious event which has become increasingly well known to other professionals and the public. No physical boards are required, only digital files. In addition to sending in a USB, files should also be uploaded to Dropbox.
Details here: CALL FOR ENTRIES
Please note that the deadline for submission is August 31, 2018 at 5PM and, for any enquiries, you may contact email@example.com.
Save the Date for our 2018 Honors and Awards Exhibition from November 19-22 at the Rotunda in Exchange Square and Annual Dinner & Awards Ceremony on November 19, 2018.
Honors and Awards Committee of the 2018 AIA Hong Kong Chapter